DESMEARSTAR

This series is a combination of horizontal Chemical Spray, Chemical Immersion and Rinse modules for Desmear process lines for cleaning blind via and drilled holes to create the right roughness on resin surface of the innerlayer, multilayer and double side pcb’s.

The Desmear process is a combination of three different steps:

Conditioner “Sweller” to soften the resin and clean holes from drill dust with help of Ultrasonic and Forced Fluid Flow Manifold Technology.

Permanganate to smear completely the glass fibres from epoxy resin on the surface with help of Ultrasonic and Forced Fluid Flow Manifold Technology.

Neutralizer an acid solution to neutralize the excess of permanganate solution.

This series is available to accommodate panel widths of 650 (25,5”) and 760mm (30”).

Chemstar series can process panel from 0,5 to 5 mm (.020” to .200”) thickness as a standard, but can easily works with boards down to 0,05 mm. (.002”) using the Thin Material System or up to 12,7 mm. (.500”) with the Thick Board Option.

The machine has a self supporting structure totally constructed in the same materials and is available from left to right conveyor direction or mirror version.

The upper spray pipes can be removed from the top and lower spray pipes can be easily removed from the side of the machine and exact repositioned after cleaning and maintenance operations.

The Modular design offers the possibility to add various modules in case of new production requirement.

The configuration line is in relation to the specification of the of chemical supplier; lines has been produced and installed in cooperation with different chemical suppliers.

Chemstar has different versions of dryers in relation of the process and the drying capability required.

Automatic spraying pressure regulation, solution make-up devices can be implemented as options with Chemstar series for many different process of the fabrication of printed circuits.