TIN STRIPPER

CHEMSTAR is a modular series of Polypropylene and Stainless Steel AISI 316 Modules for the combination of Tin Stripping Lines in the fabrication of printed circuit boards.

This series is a combination of horizontal Chemical Spray, Chemical Immersion and Rinse modules with or without Force Fluid Flow Manifold and it is ideally suited for the production of stand alone Tin Stripping lines or in combination of Dry film Stripper and Alkaline Etcher for Outerlayer production lines.

This series is available to accommodate panel widths of 650 (25,5”) and 760mm (30”).

Chemstar series can process panel from 0,5 to 5 mm (.020” to .200”) thickness as a standard, but can easily works with boards down to 0,05 mm. (.002”) using the Thin Material System or up to 12,7 mm. (.500”) with the Thick Board Option.

Chem-Ultraflex series is suitable to process panel from 0,025 core to 7 mm (.001” to .270”) thickness. This special version is dedicated to FPC production. This New Concept machines have been especially designed to satisfy the actual requirements for advanced high machine performance features at lower production costs. Read more in Ultraflex section.

The machine has a self supporting structure totally constructed in the same materials and is available from left to right conveyor direction or mirror version.

The upper spray pipes can be removed from the top and lower spray pipes can be easily removed from the side of the machine and exact repositioned after cleaning and maintenance operations.

The Modular design offers the possibility to add various modules in case of new production requirement.

The configuration line is in relation to the specification of the of chemical supplier; lines has been produced and installed in cooperation with different chemical suppliers.

Chemstar has different versions of dryers in relation of the process and the drying capability required.

Automatic spraying pressure regulation, solution make-up devices can be implemented as options with Chemstar series for many different process of the fabrication of printed circuits.