OXIDESTAR

This series is a combination of horizontal Chemical Spray, Chemical Immersion and Rinse modules for Oxide Replecement process lines, thus the Innerlayer copper surface conditioning.

Oxide replacement or Alternative Oxide is used for replacing traditional black oxide process. It creates a uniform, brown, organ metallic conversion coating on copper surfaces, ensuring enhanced bonding between the inner layers and the pre-preg used in multilayer manufacture.
Machine provides enough condition for chemical reaction; special design flood bar ensure chemical exchange flow rate and uniform coating between chemical and copper surface.

Specific materials have been used in transportation system to prevent roller mark forming on the panel surface.

Typical process flow: Acid and/or Alkaline cleaner to remove finger print, Pre-dip to prepare the copper surface to the following step and avoid drag-out from cleaner, Oxide replacement process to provide the right copper roughness and topography for proper bonding of the resin, final DI rinse and dryer.

This series is available to accommodate panel widths of 650 (25,5”) and 760mm (30”).

Chemstar series can process panel from 0,5 to 5 mm (.020” to .200”) thickness as a standard, but can easily works with boards down to 0,05 mm. (.002”) using the Thin Material System or up to 12,7 mm. (.500”) with the Thick Board Option.

The machine has a self supporting structure totally constructed in the same materials and is available from left to right conveyor direction or mirror version.

The upper spray pipes can be removed from the top and lower spray pipes can be easily removed from the side of the machine and exact repositioned after cleaning and maintenance operations.

The Modular design offers the possibility to add various modules in case of new production requirement.

The configuration line is in relation to the specification of the of chemical supplier; lines has been produced and installed in cooperation with different chemical suppliers.

Chemstar has different versions of dryers in relation of the process and the drying capability required.

Automatic spraying pressure regulation, solution make-up devices can be implemented as options with Chemstar series for many different process of the fabrication of printed circuits.